| 沈嘉辰,丘纯涛,王宜,龙金,熊志远,胡健.基于修正叠层法的纸张面内导热性质测试方法研究[J].中国造纸,2025,44(7):122-130 |
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| 基于修正叠层法的纸张面内导热性质测试方法研究 |
| Modified Lamination Method for In-plane Thermal Conductivity Testing of Paper-based Materials |
| 收稿日期：2025-02-23 修订日期：2025-04-11 |
| DOI：10.11980/j.issn.0254-508X.2025.07.014 |
| 关键词: 瞬态平面热源法 稳态热阻测试 芳纶纸 导热系数 |
| Key Words:transient plane source method steady-state thermal resistance testing aramid paper thermal conductivity |
| 基金项目:国家重点研发计划（2021YFB3700104）。 |
| 作者 | 单位 | 邮编 | | 沈嘉辰* | 华南理工大学轻工科学与工程学院,广东广州,510640 | 510640 | | 丘纯涛 | 华南理工大学轻工科学与工程学院,广东广州,510640 | 510640 | | 王宜 | 华南理工大学轻工科学与工程学院,广东广州,510640 | 510640 | | 龙金 | 华南理工大学轻工科学与工程学院,广东广州,510640 | 510640 | | 熊志远* | 华南理工大学轻工科学与工程学院,广东广州,510640 | 510640 | | 胡健 | 华南理工大学轻工科学与工程学院,广东广州,510640 | 510640 |
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| 摘要:本研究提出一种精确测量纸张面内导热系数的新方法，即结合瞬态平面热源法与稳态热阻法。首先利用瞬态法测得叠层纸张的导热系数，然后通过稳态法确定纸张叠层之间的层间热阻，进而推算出单层纸张的面内导热系数。以芳纶纸为典型研究对象，通过实验优化提出了具体的测试条件：纸张叠层厚度宜控制在3 mm以上（约50层），可有效防止测试过程中瞬态热流逸散；施加压力应不超过0.12 MPa，以减少对纸张结构的改变，确保测试结果的稳定性与可靠性。在此条件下，所测得的芳纶纸面内导热系数为0.41 W/(m·K)。此外，该改进方法在测试含纳米氮化硼填料的芳纶复合纸时，同样表现出高适用性，体现了良好的应用前景和推广价值。 |
| Abstract:This paper proposed a new method for accurately measuring the in-plane thermal conductivity of paper， which combined the transient plane source method and the steady-state thermal resistance method. Firstly， the thermal conductivity of laminated paper was measured using the transient method. Then， the interlayer thermal resistance between paper layers was determined using the steady-state method， and the in-plane thermal conductivity of single-layer paper was calculated. Taking aramid paper as a typical research object， specific testing conditions were proposed through experimental optimization： The stack thickness of the paper should be controlled at 3 mm or more (about 50 layers)， which could effectively prevent transient heat dissipation during the testing process. The applied pressure should not exceed 0.12 MPa to reduce changes to the paper structure and ensure the stability and reliability of the test results. Under these conditions， the measured internal thermal conductivity of the aramid paper surface was 0.41 W/(m·K). In addition， the modified method also showed good applicability in testing aramid composite paper containing nano boron nitride fillers， demonstrating good application prospects and promotion value. |
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